Semiconductor Packaging News

Industry Press

What Year Was It?

The day was Apr 24. What year was it?

Easter Rebellion Begins

The Irish Republican Brotherhood, a secret organization of Irish nationalists led by Patrick Pearse, launches the so-called Easter Rebellion, an armed uprising against British rule.
See the answer below.

What Year Was It Answer

Easter Rebellion Begins
Answer: April 24, 1916

April 24, 2024

Foundry 'Overcapacity' Amid AI Semiconductor Wars, Overheated HBM Market
Amidst fierce competition in the AI semiconductor sector, the foundry industry faces challenges of stagnant demand and overcapacity. Samsung delays factory operations strategically, adjusting to market conditions. TSMC downgrades growth forecast, signaling industry slowdown.
Business Korea

India is a key chip design market, Qualcomm says, as Modi makes semiconductor push
Qualcomm highlights India's pivotal role in chip design, echoing PM Modi's push for indigenous semiconductor manufacturing. With growing demand and government support, India emerges as a crucial player in the global chip market.
CNBC

Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
The white paper details a real-world use case where dummy IC packages converted to Open-Cavity Plastic Packages (OCPP) passed stringent burn-in and MSL tests equivalent to factory-fresh parts.
Technical Paper

Faraday expects contributions from AI to keep rising
Faraday Technology Corp, an ASIC designer, raised its AI-related revenue projection to a high single digit this year, driven by demand for advanced 2.5D packaging. President Steve Wang anticipates further growth next year as more AI chips enter mass production.
Taipei Times

TSMC says operations not affected by quakes
Despite strong earthquakes centered in eastern Taiwan, Taiwan Semiconductor Manufacturing Co. (TSMC) maintained normal operations. Evacuating workers as a precaution, TSMC ensured safety and minimal disruption, with its fabs remaining unaffected.
Taipei Times

Technical Papers

Chiplets and Advanced Packaging: Changing System Test and Failure Analysis

Emerging Technologies for Advanced 3D Package Characterization Enable the More-than-Moore Era

Package and Die Attach Material Comparisons for High Power GaN Devices

Compatibility of pH-Neutral Cleaning Agent with Under-bump Materials

S-SWIFT® Packaging with Fine Pitch Embedded Trace RDL

Cleaning of Silicone and Hydrocarbon Contact Residue Using Atmospheric Plasma

Highly Selective Epoxy Molding Compound Removal in Advanced Semiconductor Devices

MORE TECHNICAL PAPERS

TSMC AZ & Samsung get CHIPS Money; IMAPS Hosts 2nd Annual Onshoring Conference
The Department of Commerce announces a $6.6B funding for TSMC-AZ under the CHIPS and Science Act, paving the way for three cutting-edge fabs in Arizona. TSMC's investment of over $65B aims, supporting major tech players like AMD, Apple, Nvidia, and Qualcomm.
3DInCites

Apple iPhone sales drop 19% in China as demand for Huawei smartphones soars, research says
Apple faces a 19% plunge in iPhone sales in China, attributed to Huawei's surging demand, according to Counterpoint Research. The tech giant's market share decline signals fierce competition as Huawei gains ground in the lucrative Chinese smartphone market.
CNBC

SoftBank will reportedly invest nearly $1 billion in AI push, tapping Nvidia’s chips
SoftBank plans to invest millions in an AI initiative, leveraging Nvidia's chips for advanced capabilities. This move reflects a strategic push towards innovation and highlights the growing synergy between technology giants in the AI realm.
CNBC

Tech war: China acquired US-restricted Nvidia AI chips built in Super Micro, Dell and Gigabyte Technology servers, tenders show
Chinese entities, defying US restrictions, acquired advanced Nvidia AI chips via resellers despite export bans. The move amplifies tensions in the tech war, highlighting China's persistence in accessing advanced technology despite international barriers.
South China Morning Post

Research Bits: April 23
Researchers unveil a breakthrough method for enhancing quantum computing by leveraging silicon-based qubits. This advancement promises to revolutionize computing power, paving the way for faster, more efficient quantum devices with unprecedented capabilities.
Semiconductor Engineering

What did Tim Cook's SEA visit tell us?
Apple CEO Tim Cook wrapped up a whirlwind Southeast Asia tour, touching down in Vietnam, Indonesia, and Singapore from April 15-19. Engaging with local leaders and communities, Cook explored burgeoning tech landscapes and potential partnerships in the region.
Digitimes

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Test Your Knowledge

One substance is labeled "flammable." Another is labeled "inflammable." What is the difference?
See answer below.

Quote of the Day

"Your very silence shows you agree."
Euripides

Industry Calendar

Apr 29, 2024
Onshoring 2024
IMAPS & IPC

Apr 30, 2024
ABCs of Basic Electronics and Devices
SEMI

Apr 30, 2024
The 27th Annual Components for Military & Space Electronics (CMSE) Conference & Exhibition
TJ Green Associates, LLC

May 1, 2024
MEMS & Sensors Technical Congress (MSTC)
SEMI

May 7, 2024
Intro to Semiconductor Design & Fabrication
SEMI

FULL INDUSTRY CALENDAR

Test Your Knowledge Answer

One substance is labeled "flammable." Another is labeled "inflammable." What is the difference?
Answer: Nothing - Both adjectives describe a substance that is easily ignited.