MAGAZINE
March
Researchers Develop Energy-Efficient Computer by Combining CMOS with Stochastic Nanomagnet
Researchers at Tohoku University and the University of California, Santa Barbara have unveiled a probabilistic computer prototype.
Plant Sensors Could Act as an Early Warning System for Farmers
Sensors that detect plant signaling molecules can reveal when crops are experiencing too much light or heat, or attack from insects or microbes.
SEMI Applauds CHIPS Program Office Progress to Diversify U.S. Semiconductor Industry Workforce
The report outlines key aspects of the work to execute on Congress’s mandate to advance opportunity and inclusion as it brings back manufacturing and supply chains to the U.S.
Infineon Provides FOXESS with Power Semiconductors
Infineon Technologies AG supplies its power semiconductor devices to FOXESS, a fast-growing leader in the green energy industry and a manufacturer of inverters and energy storage systems.
Semiconductor Chips Drive Innovation in AI and Industries, Says GlobalData
Semiconductor chips are driving a transformative wave across technology, healthcare, automotive, telecom, and power industries. These chips, particularly those fueling AI capabilities, are fundamentally reshaping industries, ushering in a new era of innovation and efficiency gains, according to GlobalData
SIA Applauds CHIPS Act Incentives for Samsung Manufacturing Projects in Texas
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Samsung.
Quantum Electronics: Charge Travels Like Light in Bilayer Graphene
An international research team led by the University of Göttingen has demonstrated experimentally that electrons in naturally occurring double-layer graphene move like particles without any mass, in the same way that light travels.
Untether AI Announces Collaboration with Arm
The automotive collaboration addresses the transformative era of the software-defined vehicle.
Former Intel Executive Thomas Lantzsch Joins Canatu’s Board of Directors
Canatu today announced the appointment of former Intel executive Thomas Lantzsch to Canatu’s Board of Directors.
Samsung to Establish Leading-Edge Semiconductor Ecosystem in Central Texas with CHIPS Act Funding
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Samsung Electronics (Samsung) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $6.4 billion in direct funding under the CHIPS and Science Act to strengthen the resilience of the U.S. semiconductor supply chain, advance U.S. technology leadership, and fuel U.S. global competitiveness.
SMU Prof to Use NSF Grant to Develop Game-Based Semiconductor Curriculum for High School Students
Innovative project aims to bridge knowledge gaps and inspire future semiconductor professionals.
Stretchable Quantum Dot Display
Intrinsically stretchable quantum dot-based light-emitting diodes achieved record-breaking performance.
Fortemedia Unveils Coil-based MEMS Speaker Product Family
Fortemedia Inc. announces the launch of its latest innovation, the Coil-based MEMS Speaker Product Family, ForteSound, and its first product FS01.
SweGaN Announces RFHIC Strategic Equity Investment and Joint Product Development
SweGaN AB announces it has entered strategic partnership with South Korea based RFHIC Corporation.
Microchip Technology Acquires Neuronix AI Labs
Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs).
Universal Display Corporation’s Dr. Julie Brown to Receive Prestigious USC Viterbi Engineering Award
Universal Display Corporation announced that the University of Southern California (USC) will be honoring UDC’s Executive Vice President and Chief Technical Officer, Dr. Julie Brown, with the Daniel J. Epstein Engineering Management Award.
Renesas Commences Operations of Kofu Factory
Renesas Electronics Corporation today announced that it has started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan.
A Novel Machine Learning Model for the Characterization of Material Surfaces
Machine learning (ML) enables the accurate and efficient computation of fundamental electronic properties of binary and ternary oxide surfaces, as shown by scientists from Tokyo Tech.
IMAPS & IPC to Host Onshoring Workshop
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
Rapidus Announces U.S. Subsidiary and Opens Silicon Valley Office
Rapidus Corporation today announced it has formed a U.S. subsidiary, Rapidus Design Solutions (RDS); opened an office for the Americas in Santa Clara, California; and named long-time semiconductor executive Henri Richard as general manager and president of the U.S. organization.
Infineon and Amkor Announce Extended Partnership
Infineon Technologies AG is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a provider of semiconductor packaging and test services.
Semiconductor Advanced Packaging Market Size to Record $22.79B Growth from 2024-2028
The global semiconductor advanced packaging market size is estimated to grow by USD 22.79 billion from 2024 to 2028, according to Technavio.
Global PC Shipments Return to Growth and Pre-Pandemic Volumes in the First Quarter of 2024
After two years of decline, the worldwide traditional PC market returned to growth during the first quarter of 2024 (1Q24) with 59.8 million shipments, growing 1.5% year over year, according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.
Featured Video
Winnie Nabea, Global Product Manager at Mettler-Toledo Thornton, explains the importance of monitoring silica in ultra-high purity (UHP) water used in semiconductor manufacturing plants. Silica is one of the most critical indicators of the health of the water system. A rise in silica levels means the resin is approaching exhaustion and needs to be regenerated. If silica is not monitored, contamination of the ultrapure water can occur. She explains where silica should be monitored, outside factors that may cause silica issues, the best methods for monitoring silica, and how Mettler-Toledo is helping semiconductor manufacturers monitor the overall health of their water treatment plants.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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